The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Feb. 14, 2023
Chipbond Technology Corporation, Hsinchu, TW;
Chin-Tang Hsieh, Kaohsiung, TW;
Lung-Hua Ho, Hsinchu, TW;
Chih-Ming Kuo, Hsinchu County, TW;
Chun-Ting Kuo, Kaohsiung, TW;
Yu-Hui Hu, Pingtung County, TW;
Chih-Hao Chiang, Hsinchu County, TW;
Chen-Yu Wang, Hsinchu, TW;
Kung-An Lin, Hsinchu, TW;
Pai-Sheng Cheng, Hsinchu, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A flip-chip bonding structure includes a substrate and a chip. A lead of the substrate includes a body, a hollow opening, a bonding island and at least one connecting bridge. The hollow opening is in the body and surrounded by the body. The bonding island is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The connecting bridge is located in the hollow space to connect the body and the bonding island. A bump of the chip is bonded to the bonding island by a solder. The solder is restricted on the bonding island and separated from the body by the hollow space so as to avoid the solder from overflowing to the body and avoid the chip from shifting.