Hsinchu, Taiwan

Chen-Yu Wang

This inventor holds 10 USPTO granted patents and 2 published patent applications. Top assignees: Chipbond Technology Corporation, Epistar Corporation, Ganrich Semiconductor Corporation. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chen-Yu Wang. Retrieved from https://idiyas.com/inventor/chen-yu-wang-6b9l69fl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2026

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10 patents (USPTO):Explore Patents

Title: Chen-Yu Wang: Innovator in Electronic Packaging

Introduction

Chen-Yu Wang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 10 patents. His innovative designs and methods have advanced the technology used in electronic devices.

Latest Patents

Among his latest patents is a package structure that includes a substrate, an integrated transistor, and an encapsulation structure. This integrated transistor comprises a transistor, a capacitor, a resistor, and two Zener diodes. The design ensures efficient electrical connections and encapsulation, enhancing the performance of electronic packages. Another notable patent is related to the manufacturing method of an electronic package, which involves forming grooves on a circuit structure to create circuit layers. This method minimizes the risk of burrs on the electronic package, improving the overall quality of the product.

Career Highlights

Chen-Yu Wang has worked with notable companies such as Epistar Corporation and Ganrich Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics industry.

Collaborations

Throughout his career, Chen-Yu Wang has collaborated with talented individuals, including Sheng-Bo Wang and Chiao Fu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Chen-Yu Wang's contributions to electronic packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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