The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Nov. 17, 2022
Chipbond Technology Corporation, Hsinchu, TW;
Shrane-Ning Jenq, Hsinchu County, TW;
Chen-Yu Wang, Hsinchu, TW;
Chin-Tang Hsieh, Kaohsiung, TW;
Shu-Yeh Chang, Hsinchu, TW;
Lung-Hua Ho, Hsinchu, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.