This inventor holds 26 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Chipbond Technology Corporation. Active years: 2013-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013-2026
Areas of Expertise:
Title: The Innovative Mind of Chin-Tang Hsieh in Chip Technology
Introduction
Chin-Tang Hsieh is a prominent inventor based in Kaohsiung, Taiwan, recognized for his significant contributions to microchip technology. With an impressive portfolio of 22 patents, Hsieh has consistently pushed the boundaries of innovation in the field, focusing on advancements that enhance the efficiency and reliability of chip packaging.
Latest Patents
Among Hsieh's latest innovations are two notable patents. The first, titled "Chip Package and Chip Thereof," details a sophisticated design where a microchip is electrically connected to a substrate to create a chip package, ideally suited for LED applications. This design includes a body and at least one electrode that is exposed on the body surface, featuring a confining groove and wall that help contain conductive particles of adhesive, ensuring robust electrical connections.
The second patent, "Chip on Film Package and Flexible Substrate Thereof," introduces a flexible substrate that incorporates a film and a circuit layer. This innovative approach allows the substrate to bend into flat and curved portions, greatly enhancing its compatibility with external electronic components while preventing breakage through strategically placed grooves.
Career Highlights
Chin-Tang Hsieh has built a remarkable career through his work at leading technology companies. Notably, he has been associated with Chipbond Technology Corporation and Chipbound Technology Corporation, where he has played a critical role in advancing chip packaging technologies. His expertise not only reflects in his patents but also in the evolution of products that utilize his innovations.
Collaborations
Throughout his career, Hsieh has collaborated with talented professionals such as Chih-Ming Kuo and Chia-Jung Tu. These partnerships have fostered a collaborative environment that encourages creativity and technical excellence, leading to groundbreaking developments in chip technology.
Conclusion
Chin-Tang Hsieh's contributions to microchip technology are significant and enduring. His 22 patents bear testimony to his innovative spirit and technical prowess. As the field continues to evolve, Hsieh's work remains a vital part of the advancements in chip packaging, showcasing the impact of dedicated inventors in shaping the future of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile