The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Jul. 18, 2018
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventor:
Chin-Tang Hsieh, Kaohsiung, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09009 (2013.01); H05K 2201/10386 (2013.01);
Abstract
A layout structure of flexible circuit board includes a flexible substrate and leads formed on a surface of the flexible substrate. Each of the leads has a bump connection end and a curved part. The bump connection end of each of the leads is located on a chip disposition area of the surface and electrically connected to a chip. The curved part has a first connection point and a second connection point, and the length of the curved part is longer than a straight-line distance between the first and second connection points.