Shu-Yeh Chang

Title: The Innovations of Shu-Yeh Chang

Introduction

Shu-Yeh Chang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the reliability and efficiency of semiconductor packages.

Latest Patents

Shu-Yeh Chang holds a patent for a semiconductor package and the method of manufacturing the same. The patent describes a method where at least one conductive wire is formed on a substrate during a wire bonding process. A ball end of the conductive wire is positioned above the substrate, and a molding material is applied to cover the conductive wire, leaving the ball end exposed. An EMI shielding layer is then formed on the molding material, connecting to the ball end. This design increases the connection area between the EMI shielding layer and the conductive wire, thereby improving connection strength and reliability.

Career Highlights

Shu-Yeh Chang is currently employed at Chipbond Technology Corporation, where he continues to innovate in semiconductor packaging. His work has been instrumental in advancing the technology used in this field. He has a total of 1 patent to his name, showcasing his contributions to the industry.

Collaborations

Shu-Yeh Chang has collaborated with several talented individuals in his field, including Chen-Yu Wang and Shrane-Ning Jenq. These collaborations have further enriched his work and contributed to the advancements in semiconductor technology.

Conclusion

Shu-Yeh Chang's innovative approach to semiconductor packaging has made a significant impact in the industry. His patent reflects his commitment to improving technology and enhancing reliability in semiconductor applications.