For the Inventor, By the Inventor

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Hsinchu, Taiwan

Ganrich Semiconductor Corporation

USPTO Granted Patents = 3

Forward Citations = 0

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5 inventors (with patents filed for the assignee):

Sheng-Bo Wang (3 out of 5 patents)

Yao-Zhong Liu (2 out of 4 patents)

Jia-Tay Kuo (2 out of 5 patents)

4. Chen-Yu Wang (2 out of 6 patents)

5. Chiao Fu (2 out of 3 patents)

3 patents: Sort by Forward Citations

1. 12394768 - Package structure (2025-08-19),

2. 12254802 - Light-emitting device driving circuit (2025-03-18),

3. D1059315 - Package structure for a semiconductor element (2025-01-28),

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USPTO Data Jan 1 1976 - Dec 23 2025

3 Patents

#277 in Hsinchu

#3,190 in Taiwan

Hsinchu, Taiwan

Ganrich Semiconductor Corporation

Forward Citations = 0

5 inventors:

Sheng-Bo Wang (3 out of 5 patents)

Yao-Zhong Liu (2 out of 4 patents)

Jia-Tay Kuo (2 out of 5 patents)

4. Chen-Yu Wang (2 out of 6 patents)

5. Chiao Fu (2 out of 3 patents)

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