Company Filing History:
Years Active: 2022-2025
Title: Yao-Zhong Liu: Innovator in Semiconductor Packaging
Introduction
Yao-Zhong Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in integrated circuits and electronic devices.
Latest Patents
One of Yao-Zhong Liu's latest patents is a package structure that includes a substrate, an integrated transistor, and an encapsulation structure. This integrated transistor is positioned on the substrate and comprises a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor features a gate, a drain, and a source, with the capacitor and resistor electrically connected to the gate. The first Zener diode has a first anode and a first cathode connected to the gate, while the second Zener diode connects its second anode to the first anode and its second cathode to the source. The encapsulation structure serves to protect the integrated transistor, and the package structure includes a gate terminal, a drain terminal, and a source terminal.
Career Highlights
Throughout his career, Yao-Zhong Liu has worked with notable companies in the semiconductor industry, including Ganrich Semiconductor Corporation and Epistar Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Yao-Zhong Liu has collaborated with several talented individuals in his field, including Sheng-Bo Wang and Chen-Yu Wang. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies.
Conclusion
Yao-Zhong Liu's work in semiconductor packaging has made a lasting impact on the industry. His innovative patents and collaborations with other professionals highlight his dedication to advancing technology. His contributions continue to shape the future of electronic devices and integrated circuits.