Chih-Hao Chiang

Title: Chih-Hao Chiang: Innovator in Package Structure Technology

Introduction

Chih-Hao Chiang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of package structure technology, particularly in the area of electromagnetic interference (EMI) shielding.

Latest Patents

Chih-Hao Chiang holds a patent for a "Package structure with conformal shielding and inspection method using the same." This innovative package structure includes a substrate that provides electrically connected inner grounding structures. A chip module is mounted on the substrate, which is then covered by a molding compound. Additionally, a conductive shielding layer covers the molding compound and the lateral sides of the substrate, ensuring electrical connection with part of the inner grounding structures. The substrate also features one or multiple independent conductive structures that are electrically connected to the conductive shielding layer and exposed to the outside. By measuring the resistance value between these independent conductive structures and the conductive shielding layer, the EMI shielding performance of the package structure can be effectively determined.

Career Highlights

Throughout his career, Chih-Hao Chiang has worked with prominent companies in the technology sector. He has been associated with Universal Scientific Industrial Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His work in these organizations has contributed to advancements in electronic packaging and shielding technologies.

Collaborations

Chih-Hao Chiang has collaborated with esteemed colleagues, including Jaw-Ming Ding and Chien-Yeh Liu. These partnerships have fostered innovation and development in their respective fields.

Conclusion

Chih-Hao Chiang's contributions to package structure technology and EMI shielding are noteworthy. His innovative patent and collaborations with industry professionals highlight his impact on the field. His work continues to influence advancements in electronic packaging solutions.