Chun-Ting Kuo

Title: Innovations of Chun-Ting Kuo in Semiconductor Technology

Introduction

Chun-Ting Kuo is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor structure that enhances manufacturing processes.

Latest Patents

Chun-Ting Kuo holds a patent for a semiconductor structure and method of manufacturing the same. This patent describes a semiconductor structure that includes a substrate, a dielectric layer, a connection layer, and wire layers. The dielectric layer is positioned on the substrate's surface and features vias that expose the surface. The connection layer is placed on the dielectric layer, with a first connection portion located in the vias and connected to the surface. Additionally, a second connection portion of the connection layer is linked to the dielectric layer. The ground metal layer has a first ground portion connected to the first connection portion and a second ground portion connected to the second connection portion. Each wire layer is situated on the second connection portion, with the second ground portion positioned between adjacent wire layers. Chun-Ting Kuo has 1 patent to his name.

Career Highlights

Chun-Ting Kuo is currently employed at Chipbond Technology Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor manufacturing.

Collaborations

Chun-Ting Kuo collaborates with talented individuals in his field, including Chin-Tang Hsieh and You-Ming Hsu. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Chun-Ting Kuo's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. His patent and ongoing work at Chipbond Technology Corporation highlight his commitment to advancing technology.