The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Sep. 13, 2012
Chih-ming Kuo, Hsinchu County, TW;
Shih-chieh Chang, Chiayi County, TW;
Chih-hsien NI, Hsinchu, TW;
Chin-tang Hsieh, Kaohsiung, TW;
Chia-jung Tu, Hsinchu County, TW;
Lung-hua Ho, Hsinchu, TW;
Chih-Ming Kuo, Hsinchu County, TW;
Shih-Chieh Chang, Chiayi County, TW;
Chih-Hsien Ni, Hsinchu, TW;
Chin-Tang Hsieh, Kaohsiung, TW;
Chia-Jung Tu, Hsinchu County, TW;
Lung-Hua Ho, Hsinchu, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A semiconductor package includes a lead frame, at least one chip and a molding compound. The lead frame comprises a plurality of leads, each lead comprises a first end portion and at least one coupling protrusion, wherein the first end portion comprises a first upper surface, the coupling protrusion comprises a ring surface and is integrally formed as one piece with the first upper surface. The chip disposed on top of the leads comprises a plurality of bumps and a plurality of solders, the coupling protrusions embed into the solders to make the ring surfaces of the coupling protrusions cladded with the solders. The solders cover the first upper surfaces. The chip and the leads are cladded with the molding compound.