Company Filing History:
Years Active: 2013-2015
Title: Chih-Hsien Ni: Innovating Semiconductor Packaging in Hsinchu
Introduction: Chih-Hsien Ni, located in Hsinchu, Taiwan, is a notable inventor in the field of semiconductor packaging. With a total of four patents to his name, his contributions have significantly advanced the techniques and structures used in this vital area of technology.
Latest Patents: Ni's latest patents include innovative designs that enhance semiconductor package structures and methods for their production. One of his prominent patents involves a semiconductor package structure that features a first substrate, a second substrate, and an encapsulant. This design incorporates a plurality of first bumps and solder layers on the first substrate, complemented by a second substrate with its corresponding bumps and solder layers. The inventive coupling of these layers includes cone-shaped slots and bodies that improve the interconnection and integrity of the semiconductor assembly.
Another noteworthy patent authored by Ni is related to a semiconductor package and its lead frame. This invention features a lead frame with several leads, incorporating coupling protrusions that are integrally formed with an upper surface. The interaction between the chip and the leads is engineered through the embedding of coupling protrusions into solder materials, offering a robust and efficient arrangement analogous to the previous patent.
Career Highlights: Chih-Hsien Ni is associated with Chipbond Technology Corporation, a reputable company in the semiconductor industry. His innovative designs and patents underscore a successful career dedicated to enhancing semiconductor technology through effective packaging solutions.
Collaborations: Throughout his career, Ni has collaborated with esteemed coworkers, including Chin-Tang Hsieh and Chih-Ming Kuo. These collaborations have played an essential role in driving innovation and advancing the collective expertise within semiconductor packaging.
Conclusion: Chih-Hsien Ni has made significant contributions to the field of semiconductor technology with his inventive spirit and dedication to improving packaging methods. His patents and ongoing work at Chipbond Technology Corporation continue to influence the industry, paving the way for future advancements in semiconductor applications.