Location History:
- Zhudong Township Hsinchu County, TW (2013)
- Hsinchu County, TW (2013 - 2016)
- Hsinchu, TW (2014 - 2018)
Company Filing History:
Years Active: 2013-2018
Title: Chia-Jung Tu: Innovator in Flexible Substrates and Wafer Dicing Methods
Introduction
Chia-Jung Tu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of electronics through his innovative patents. With a total of nine patents to his name, Tu has established himself as a key figure in the development of advanced technologies.
Latest Patents
Among his latest inventions is a flexible substrate that includes a circuit board, a flexible heat-dissipating structure, and an adhesive. The circuit board features a substrate with a circuit layer formed on its top surface. The flexible heat-dissipating structure consists of a flexible supporting plate and a flexible heat-dissipating metal layer, which is connected to the substrate's bottom surface by the adhesive. Notably, both the circuit layer and the flexible heat-dissipating metal layer are made from the same material. Another significant patent is a wafer dicing method that involves providing a wafer and executing a cutting procedure along with a contacting procedure. This method includes a metal layer formed on a scribe line between adjacent dies. A cutter is utilized to cut the metal layer along the scribe line, resulting in multiple dies on the wafer, while a brush is employed to manage metal burrs during the contacting procedure.
Career Highlights
Chia-Jung Tu has worked with notable companies such as Chipbond Technology Corporation and Chipbond Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in technology.
Collaborations
Tu has collaborated with esteemed colleagues, including Chin-Tang Hsieh and Chih-Ming Kuo. These partnerships have fostered an environment of innovation and creativity, leading to the development of his impactful patents.
Conclusion
Chia-Jung Tu's work in flexible substrates and wafer dicing methods showcases his dedication to advancing technology. His contributions have not only enhanced the field of electronics but also paved the way for future innovations.