The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Jun. 20, 2011
Chin-tang Hsieh, Kaohsiung, TW;
Hou-chang Kuo, Kaohsiung, TW;
Dueng-shiu Tzou, Kaohsiung, TW;
Chia-jung Tu, Hsinchu County, TW;
Gwo-shyan Sheu, Kaohsiung, TW;
Chin-Tang Hsieh, Kaohsiung, TW;
Hou-Chang Kuo, Kaohsiung, TW;
Dueng-Shiu Tzou, Kaohsiung, TW;
Chia-Jung Tu, Hsinchu County, TW;
Gwo-Shyan Sheu, Kaohsiung, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a top surface, a bottom surface and a plurality of apertures formed at the bottom surface, wherein the bottom surface of the insulating layer comprises a disposing area and a non-disposing area. Each of the apertures is located at the disposing area and comprises a lateral wall and a base surface. A first thickness is formed between the base surface and the insulating layer, a second thickness is formed between the top surface and the bottom surface, and the second thickness is larger than the first thickness. The chip disposed on the top surface comprises a chip surface and a plurality of bumps. The heat dissipation paste at least fills the apertures and contacts the base surface.