Dueng-Shiu Tzou

Title: Dueng-Shiu Tzou: Innovator in Flip Chip Packaging

Introduction

Dueng-Shiu Tzou, an accomplished inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor packaging through his innovative designs. With a total of two patents to his name, Tzou's work is particularly notable in the development of thin flip chip package structures, which enhance the efficiency of electronic components.

Latest Patents

Tzou's latest patents focus on the design of thin flip chip package structures, which play a critical role in the assembly and performance of microelectronic devices. The first patent describes a thin flip chip package structure that includes a substrate, a chip, and a heat dissipation paste. This innovative design features an insulating layer and a trace layer, where the bottom surface of the insulating layer is equipped with a plurality of apertures to support heat dissipation. The second patent further refines this concept, detailing an insulating layer that comprises both first and second insulating portions, with varying thicknesses that optimize heat management and electrical connectivity. These inventions aim to improve the thermal performance and compactness of semiconductor devices.

Career Highlights

Dueng-Shiu Tzou has gained valuable experience during his tenure at notable organizations such as Chipbond Technology Corporation and Chipbound Technology Corporation. His work in these companies has allowed him to refine his expertise in flip chip packaging technology, leading to his innovative patent applications.

Collaborations

Throughout his career, Tzou has had the opportunity to collaborate with distinguished professionals in the field. Notable colleagues include Chin-Tang Hsieh and Hou-Chang Kuo, who have worked alongside him in driving advancements in semiconductor solutions.

Conclusion

Dueng-Shiu Tzou stands out as a pivotal figure in the realm of semiconductor packaging invention. His patents on thin flip chip package structures demonstrate a commitment to pushing the boundaries of technology and improving the efficiency of electronic devices. As the industry continues to evolve, Tzou's contributions will likely influence future innovations in the field.