Hou-Chang Kuo

Title: The Innovations of Hou-Chang Kuo

Introduction

Hou-Chang Kuo is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of flip chip package structures.

Latest Patents

One of his latest patents is a thin flip chip package structure that comprises a substrate, a chip, and a heat dissipation paste. This innovative design includes an insulating layer with a top surface, a bottom surface, and multiple apertures. The apertures are strategically located in a disposing area, featuring a lateral wall and a base surface. The design ensures that the first thickness between the base surface and the insulating layer is less than the second thickness between the top and bottom surfaces. The chip, which is placed on the top surface, includes a chip surface and several bumps, while the heat dissipation paste fills the apertures and contacts the base surface. Another patent describes a similar thin flip chip package structure, emphasizing the importance of the insulating portions and the trace layer for electrical connections.

Career Highlights

Throughout his career, Hou-Chang Kuo has worked with prominent companies in the semiconductor industry, including Advanced Semiconductor Engineering, Inc. and Chipbond Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

He has collaborated with notable colleagues such as Chin-Tang Hsieh and Dueng-Shiu Tzou, further enhancing his contributions to the field.

Conclusion

Hou-Chang Kuo's work in developing advanced flip chip package structures showcases his innovative spirit and dedication to improving semiconductor technology. His patents reflect a commitment to enhancing efficiency in electronic devices, making him a significant figure in the industry.