Company Filing History:
Years Active: 2016-2025
Title: Innovations of Yin-Chen Lin
Introduction
Yin-Chen Lin is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of technology, particularly in the area of circuit board design and packaging. With a total of 6 patents to his name, Lin continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is the "Flip chip package and substrate thereof." This invention features a light-transmissive carrier with lines, including an identification line and a dummy line, on its first surface. A supportive layer is placed on the second surface, allowing for the inspection of bumps and an identification bump to ensure proper bonding. Another significant patent is the "Double-sided flexible circuit board." This design includes a flexible substrate with through circuit lines, first circuit lines, and second circuit lines, enhancing the functionality and efficiency of circuit boards.
Career Highlights
Yin-Chen Lin is currently employed at Chipbond Technology Corporation, where he applies his expertise in circuit design and packaging. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
Lin collaborates with talented individuals such as Hui-Yu Huang and Chih-Ming Peng, contributing to a dynamic work environment that fosters innovation.
Conclusion
Yin-Chen Lin's contributions to technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of advanced electronic solutions.