The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Jun. 27, 2023
Chipbond Technology Corporation, Hsinchu, TW;
Chun-Te Lee, Hsinchu County, TW;
Chih-Ming Peng, Taichung, TW;
Pi-Yu Peng, Hsinchu County, TW;
Hui-Yu Huang, Hsinchu, TW;
Yin-Chen Lin, Miaoli County, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.