Pi-Yu Peng

Title: Innovations by Pi-Yu Peng

Introduction

Pi-Yu Peng is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and patents. With a total of 3 patents to his name, Peng continues to push the boundaries of technology in his industry.

Latest Patents

Among his latest patents is the "Flip chip package and substrate thereof." This invention features a flip chip package that includes lines, an identification line, and a dummy line on a light-transmissive carrier. A supportive layer is placed on the opposite side, allowing for inspection of the bonding process through visible shadows. Another significant patent is the "Flip-chip bonding structure and circuit board thereof." This design incorporates a chip bonded to a circuit board using bumps, with a light-transmissive substrate that helps identify the boundary between circuit groups through shadow recognition.

Career Highlights

Pi-Yu Peng is currently employed at Chipbond Technology Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of flip-chip bonding processes.

Collaborations

Throughout his career, Peng has collaborated with talented individuals such as Chun-Te Lee and Chih-Ming Peng. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Pi-Yu Peng's contributions to the field of semiconductor packaging through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future innovations.