Hui-Yu Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the structural integrity and functionality of semiconductor packages.

Latest Patents

One of his latest patents is titled "Semiconductor package having flow-guiding grooves and circuit board thereof." This invention includes a chip, a circuit board, and a filling material. The circuit board features a substrate, a patterned metal layer, and a protective layer. A circuit area, a chip-mounting area, and a flow-guiding area are defined on the substrate's surface. The chip is mounted on the chip-mounting area, while a flow-guiding member of the patterned metal layer is arranged on the flow-guiding area. This member includes a hollow portion and flow-guiding grooves that communicate with the hollow portion and are arranged radially. The flow-guiding grooves facilitate the flow of the protective layer toward the hollow portion, allowing the filling material to cover the protective layer and improve the structural strength of the semiconductor package.

Another notable patent is the "Flip chip package and substrate thereof." In this invention, lines, an identification line, and a dummy line are provided on the first surface of a light-transmissive carrier. A supportive layer is disposed on the second surface of the carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. The shadows of the dummy line, the identification line, and the identification bump, which are projected on the second surface, are visible from an opening of the supportive layer. This design allows for inspection through the opening to ensure that the bumps are correctly bonded to the lines.

Career Highlights

Hui-Yu Huang is currently employed at Chipbond Technology Corporation, where he continues to innovate in semiconductor packaging technologies. His expertise and inventions have significantly impacted the industry, leading to advancements in product reliability and performance.

Collaborations

Hui-Yu Huang collaborates with talented individuals such as Chih-Ming Peng and Chun-Te Lee, contributing to a dynamic and innovative work environment.

Conclusion

Hui-Yu Huang's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work

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