The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jun. 24, 2020
Chipbond Technology Corporation, Hsinchu, TW;
Yi-Chen Lien, Taichung, TW;
Yen-Ping Huang, Kaohsiung, TW;
Hui-Yu Huang, Hsinchu, TW;
Chih-Ming Peng, Taichung, TW;
Chun-Te Lee, Hsinchu County, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A circuit board includes a substrate, a first measurement mark and a second measurement mark, the first and second measurement marks are located on a predetermined punch area of the substrate. After punching, the predetermined punch area is removed such that the circuit board has a through hole and a sheet is separated from the circuit board. By the first and second measurement marks on the sheet, a first distance between a first edge of the sheet and the first measurement mark and a second distance between a second edge of the sheet and the second measurement mark can be measured to determine whether the through hole is shifted or has an incorrect size.