Chih-Ming Peng is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of technology, particularly in the area of flip chip packaging. With a total of nine patents to his name, Peng's work has advanced the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents is the "Flip chip package and substrate thereof." This invention features a light-transmissive carrier with lines, an identification line, and a dummy line on its first surface. A supportive layer is placed on the second surface, allowing for the inspection of bumps and an identification bump to ensure proper bonding. Another notable patent is the "Flip-chip bonding structure and circuit board thereof." This structure includes a chip bonded to a circuit board by bumps, with a light-transmissive substrate that helps identify the boundary between circuit groups through shadow recognition.

Career Highlights

Chih-Ming Peng has established himself as a key figure at Chipbond Technology Corporation. His innovative designs and patents have played a crucial role in enhancing the company's product offerings and technological advancements. His expertise in flip chip technology has positioned him as a leader in the industry.

Collaborations

Peng has collaborated with talented coworkers such as Hui-Yu Huang and Chun-Te Lee. Their combined efforts have contributed to the successful development of various projects within the company.

Conclusion

Chih-Ming Peng's contributions to the field of technology through his patents and innovations have made a lasting impact. His work continues to influence the development of advanced electronic components, showcasing the importance of innovation in the industry.

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