The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Sep. 25, 2020
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Chia-En Fan, Hsinchu County, TW;
Hui-Yu Huang, Hsinchu, TW;
Chih-Ming Peng, Taichung, TW;
Chun-Te Lee, Hsinchu County, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0268 (2013.01); H05K 1/0286 (2013.01); H05K 1/111 (2013.01); H05K 2201/09254 (2013.01);
Abstract
A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.