This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Chipbond Technology Corporation. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: Yi-Chen Lien: Innovator in Circuit Board Technology
Introduction
Yi-Chen Lien is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and reliability of circuit boards.
Latest Patents
Yi-Chen Lien holds a patent for a "Circuit board having a predetermined punch area and sheet separated from the same." This invention includes a substrate with a first and second measurement mark located on a predetermined punch area. After the punching process, the predetermined punch area is removed, resulting in a circuit board with a through hole and a sheet that is separated from the circuit board. The first and second measurement marks on the sheet allow for precise measurements to determine if the through hole is shifted or has an incorrect size. This innovation is crucial for ensuring the quality and accuracy of circuit board manufacturing.
Career Highlights
Yi-Chen Lien is associated with Chipbond Technology Corporation, where he applies his expertise in circuit board technology. His work has been instrumental in advancing the company's product offerings and enhancing their technological capabilities.
Collaborations
Yi-Chen collaborates with talented individuals such as Yen-Ping Huang and Hui-Yu Huang, contributing to a dynamic and innovative work environment.
Conclusion
Yi-Chen Lien's contributions to circuit board technology exemplify the spirit of innovation. His patent reflects a commitment to improving manufacturing processes and ensuring product quality. His work continues to influence the field positively.