Company Filing History:
Years Active: 1996-2025
Title: Innovations by Hsin-Hao Huang
Introduction
Hsin-Hao Huang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on improving the reliability and efficiency of semiconductor packages and flexible circuit boards.
Latest Patents
Huang's latest patents include a novel semiconductor package design. This design features flow guiding strips on a flexible substrate, which help separate a chip from the substrate. This innovation allows a filling material to flow between the chip and the substrate, effectively squeezing out air and enhancing the reliability of the semiconductor package. Another notable patent is the layout structure of a flexible circuit board. This structure includes a flexible substrate, a chip, and a circuit layer, with specific areas defined for chip mounting and circuit connections. The design ensures that there is a space between the bumps of the chip, optimizing the electrical connections and overall functionality.
Career Highlights
Hsin-Hao Huang has worked with notable companies such as Chipbond Technology Corporation and Caterpillar Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Huang has collaborated with talented individuals in his field, including Yu-Chen Ma and Gwo-Shyan Sheu. These collaborations have contributed to the advancement of his projects and innovations.
Conclusion
Hsin-Hao Huang's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of reliable and efficient electronic components.