The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Jul. 27, 2020
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Yu-Chen Ma, Kaohsiung, TW;
Hsin-Hao Huang, Kaohsiung, TW;
Wen-Fu Chou, Kaohsiung, TW;
Gwo-Shyan Sheu, Kaohsiung, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/181 (2013.01); H05K 3/282 (2013.01); H05K 2201/02 (2013.01); H05K 2201/099 (2013.01);
Abstract
A chip package includes a circuit board, a chip and an underfill. A solder resist layer formed on the circuit board is modified in edge profile so as to reduce required amount of the underfill. The fewer underfill is still enough to be filled between the circuit board and the chip, and still can cover circuit lines that are not covered by the solder resist layer to protect the circuit lines from oxidation.