The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Oct. 28, 2022
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Yu-Chen Ma, Kaohsiung, TW;
Pei-Wen Wang, Taichung, TW;
Hsin-Hao Huang, Kaohsiung, TW;
Gwo-Shyan Sheu, Kaohsiung, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract
In a semiconductor package, flow guiding strips are provided on a guiding area of a flexible substrate to separate a chip and the flexible substrate such that a filling material flowing between the chip and the flexible substrate can squeeze out the air between the chip and the flexible substrate to improve the reliability of the semiconductor package.