Company Filing History:
Years Active: 2025
Title: Pei-Wen Wang: Innovator in Semiconductor Packaging
Pei-Wen Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.
Latest Patents
Pei-Wen Wang holds a patent for a semiconductor package that features flow guiding strips on a flexible substrate. This design separates a chip from the flexible substrate, allowing a filling material to flow between them. This innovation helps to squeeze out air, thereby improving the reliability of the semiconductor package. His patent is a testament to his commitment to enhancing technology in the semiconductor industry.
Career Highlights
Wang is currently employed at Chipbond Technology Corporation, where he continues to work on advancing semiconductor technologies. His role at the company allows him to apply his inventive ideas in a practical setting, contributing to the development of cutting-edge solutions in the industry.
Collaborations
Pei-Wen Wang collaborates with talented colleagues, including Yu-Chen Ma and Hsin-Hao Huang. Their teamwork fosters an environment of innovation and creativity, leading to the development of impactful technologies.
Conclusion
Pei-Wen Wang's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and work at Chipbond Technology Corporation highlight his role as a key player in the industry.