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For the Inventor, By the Inventor

San Jose, CA, United States of America

Yana Cheng

This inventor holds 15 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Applied Materials, Inc., Asml Netherlands B.v.. Active years: 2016-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yana Cheng. Retrieved from https://idiyas.com/inventor/yana-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 86.7

 

Average Co-Inventor Count = 7.3

ph-index = 3

Forward Citations = 21(Granted Patents)


Company Filing History:

goldMedal10 out of 14,454 
 
Applied Materials, Inc.
 patents
silverMedal5 out of 5,075 
 
Asml Netherlands B.v.
 patents

Years Active: 2016-2024

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15 patents (USPTO):Explore Patents
1. 12055904 - Method to predict yield of a device manufacturing process (2024-08-06),
2. 12044980 - Method of manufacturing devices (2024-07-23),
3. 11947266 - Method for controlling a manufacturing process and associated apparatuses (2024-04-02),
4. 11803127 - Method for determining root cause affecting yield in a semiconductor manufacturing process (2023-10-31),
5. 11754931 - Method for determining corrections for lithographic apparatus (2023-09-12),
6. 11056325 - Methods and apparatus for substrate edge uniformity (2021-07-06),
7. 10707122 - Methods for depositing dielectric barrier layers and aluminum containing etch stop layers (2020-07-07),
8. 10665426 - Methods for thin film material deposition using reactive plasma-free physical vapor deposition (2020-05-26),
9. 10546742 - Method to reduce trap-induced capacitance in interconnect dielectric barrier stack (2020-01-28),
10. 10170299 - Method to reduce trap-induced capacitance in interconnect dielectric barrier stack (2019-01-01),
11. 10109520 - Methods for depositing dielectric barrier layers and aluminum containing etch stop layers (2018-10-23),
12. 9984976 - Interconnect structures and methods of formation (2018-05-29),
13. 9633839 - Methods for depositing dielectric films via physical vapor deposition processes (2017-04-25),
14. 9601431 - Dielectric/metal barrier integration to prevent copper diffusion (2017-03-21),
15. 9299605 - Methods for forming passivation protection for an interconnection structure (2016-03-29),

Title: The Innovative Journey of Yana Cheng

Introduction: Yana Cheng, a pioneering inventor based in San Jose, CA, has made significant contributions to the world of technology and innovation. As a woman in a male-dominated field, she has broken barriers and inspired many with her groundbreaking work.

Latest Patents: Yana Cheng holds several patents in the field of artificial intelligence and robotics, with her most recent patent focusing on a revolutionary autonomous delivery drone system designed to streamline logistics operations.

Career Highlights: Throughout her illustrious career, Yana Cheng has worked with top tech companies in Silicon Valley, leading research and development teams to create cutting-edge solutions. Her expertise in machine learning and automation has led to the development of innovative products that have transformed industries.

Collaborations: Yana Cheng has collaborated with renowned universities and research institutions to further her research in the field of robotics. Her partnerships have resulted in groundbreaking projects that have pushed the boundaries of technological advancement.

Conclusion: Yana Cheng's dedication to innovation and her relentless pursuit of excellence have solidified her reputation as a trailblazer in the world of technology. Her passion for creating solutions that make a difference continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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