The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Nov. 04, 2019
Asml Netherlands B.v., Veldhoven, NL;
Chenxi Lin, Newark, CA (US);
Cyrus Emil Tabery, San Jose, CA (US);
Hakki Ergün Cekli, Eindhoven, NL;
Simon Philip Spencer Hastings, San Jose, CA (US);
Boris Menchtchikov, Redwood City, CA (US);
Yi Zou, Foster City, CA (US);
Yana Cheng, San Jose, CA (US);
Maxime Philippe Frederic Genin, San Mateo, CA (US);
Tzu-Chao Chen, Dublin, CA (US);
Davit Harutyunyan, San Jose, CA (US);
Youping Zhang, Cupertino, CA (US);
ASML NETHERLANDS B.V., Veldhoven, NL;
Abstract
A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.