The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Nov. 14, 2019
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Nicolaas Petrus Marcus Brantjes, Eindhoven, NL;

Matthijs Cox, Valkenswaard, NL;

Boris Menchtchikov, Redwood City, CA (US);

Cyrus Emil Tabery, San Jose, CA (US);

Youping Zhang, Cupertino, CA (US);

Yi Zou, Foster City, CA (US);

Chenxi Lin, Newark, CA (US);

Yana Cheng, San Jose, CA (US);

Simon Philip Spencer Hastings, San Jose, CA (US);

Maxim Philippe Frederic Genin, San Mateo, CA (US);

Assignee:

ASML NETHERLANDS B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70491 (2013.01); G03F 7/70633 (2013.01); G03F 9/7046 (2013.01);
Abstract

A method for determining a correction relating to a performance metric of a semiconductor manufacturing process, the method including: obtaining a set of pre-process metrology data; processing the set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which: a) correlate to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and applying a trained model to the processed set of pre-process metrology data to determine the correction for the semiconductor manufacturing process.


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