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Location History:
- Hsinchu, TW (2021 - 2023)
- Taichung, TW (2019 - 2024)
Company Filing History:
Years Active: 2019-2025
Title: Wei-Hao Liao: A Pioneer in Integrated Chip Technology
Introduction
Wei-Hao Liao, located in Taichung, Taiwan, is a prominent inventor and engineer who has made significant contributions to the field of semiconductor technology. With an impressive tally of 55 patents to his name, Liao has been at the forefront of innovation within the industry, particularly in integrated chip design.
Latest Patents
Among Liao's latest inventions is a groundbreaking integrated chip featuring inter-wire cavities. This innovation involves a substrate with a first conductive wire and a second conductive wire positioned adjacent to each other. A first dielectric cap, which includes a specialized dielectric material, separates the two wires while defining a cavity positioned below the cap. This intricate design enhances the performance and efficiency of integrated chips.
Another notable patent focuses on an interconnection structure and methods of forming the same, which consists of a conductive layer with a dielectric foam interposed between two conductive portions. This foam features fluid gaps filled with carbon dioxide gas, a technology that could potentially revolutionize interconnection methods in semiconductor devices.
Career Highlights
Liao's career is deeply intertwined with the prestigious Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in semiconductor manufacturing. His role at TSMC allows him to utilize his vast knowledge and skills to push the boundaries of technology and improve semiconductor reliability and efficiency.
Collaborations
Throughout his career, Liao has worked alongside distinguished colleagues, including Chung-Ju Lee and Hsi-Wen Tien. Their collaborative efforts contribute to a dynamic exchange of ideas and innovations within TSMC, fostering an environment that enhances creativity and technological advancements.
Conclusion
Wei-Hao Liao is a remarkable inventor whose contributions to integrated chip technology are paving the way for the future of electronics. With his extensive patent portfolio and collaborative spirit, Liao continues to leave an indelible mark on the semiconductor industry, inspiring future generations of inventors and engineers.
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