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For the Inventor, By the Inventor

Fukuoka, Japan

Tadahiko Sakai

This inventor holds 57 USPTO granted patents and 8 published patent applications and 2 EPO patents, primarily in Electronic Component Assembly (CPC class H01L). Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation, Panasonic Intellectual Property Management Co., Ltd.. Active years: 1995-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadahiko Sakai. Retrieved from https://idiyas.com/inventor/tadahiko-sakai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 57 

% Patents Active = 84.2


Average Co-Inventor Count = 2.4

ph-index = 12

Forward Citations = 409(Granted Patents)

Forward Citations (Not Self Cited) = 383(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Fukuoka, JP (1995 - 2015)
  • Kadoma, JP (2015)
  • Osaka, JP (2013 - 2018)

Company Filing History:

goldMedal25 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
silverMedal22 out of 16,454 
 
Panasonic Corporation
 patents
bronzeMedal9 out of 13,338 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents
4. 1 out of 25 
 
Matshushita Electric Industrial Co., Ltd.
 patents
5. 1 out of 89 
 
Namics Corporation
 patents
where one patent can have more than one assignee

Years Active: 1995-2025

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Areas of Expertise:
Soldering Method
Flux Coating
Mounting Structure
Electronic Components
Circuit Member
Thermocompression Bonding
Component Joining
Adhesive Agent
Semiconductor Device
Bump Mounting
IC Card
Soldering Process
57 patents (USPTO):Explore Patents
1. 12484157 - Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate (2025-11-25),
2. 12439527 - Mounting board manufacturing method and flux coating device (2025-10-07),
3. 12402255 - Method for producing electronic component mounted substrate (2025-08-26),
4. 9999123 - Connection structure of circuit member, connection method, and connection material (2018-06-12),
5. 9839143 - Electrode joining method, production method of electrode joined structure (2017-12-05),
6. 9756728 - Component-mounted structure (2017-09-05),
7. 9609760 - Electronic component mounting method (2017-03-28),
8. 9516749 - Electronic component-mounted structure, IC card and COF package (2016-12-06),
9. 9015932 - Connecting method of electronic component (2015-04-28),
10. 8960526 - Flux for soldering and soldering process (2015-02-24),
11. 8851138 - Substrate backing device and substrate thermocompression-bonding device (2014-10-07),
12. 8817487 - Electronic component mounting system and electronic component mounting method (2014-08-26),
13. 8759688 - Electronic component mounting structure (2014-06-24),
14. 8686299 - Electronic element unit and reinforcing adhesive agent (2014-04-01),
15. 8499998 - Component built-in circuit substrate and method of producing the same (2013-08-06),

Title: Tadahiko Sakai - Innovative Inventor from Fukuoka, JP

Introduction: Tadahiko Sakai is a renowned inventor hailing from Fukuoka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tadahiko Sakai holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Sakai has worked with leading research institutions and technology companies, consistently pushing the boundaries of what is possible in the world of invention.

Collaborations: Throughout his career, Tadahiko Sakai has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and creativity that has led to numerous successful projects and inventions.

Conclusion: Tadahiko Sakai's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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