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Tadahiko Sakai

USPTO Granted Patents = 57 (Patent Applications = 7)

EPO Patents = 2

Average Co-Inventor Count = 2.3

ph-index = 12

Forward Citations = 408(Granted Patents)

Forward Citations (Not Self Cited) = 383(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Fukuoka, JP (1995 - 2015)
Kadoma, JP (2015)
Osaka, JP (2013 - 2018)

Company Filing History:

25 out of 27,375

Matsushita Electric Industrial Co., Ltd.

22 out of 16,453

Panasonic Corporation

9 out of 13,307

Panasonic Intellectual Property Management Co., Ltd.

Namics Corporation

Matshushita Electric Industrial Co., Ltd.

where one patent can have more than one assignee

Years Active: 1995-2025

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Areas of Expertise:

Electronic Component Mounting

Soldering Techniques

Semiconductor Device Assembly

Flux Coating

Conductive Ball Transfer

Circuit Member Connection

Adhesive Technologies

Component Joining Methods

Thermocompression Bonding

IC Card Packaging

Substrate Manufacturing

Electronic Parts Module

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12484157 - Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate (2025-11-25),

2. 12439527 - Mounting board manufacturing method and flux coating device (2025-10-07),

3. 12402255 - Method for producing electronic component mounted substrate (2025-08-26),

4. 9999123 - Connection structure of circuit member, connection method, and connection material (2018-06-12),

5. 9839143 - Electrode joining method, production method of electrode joined structure (2017-12-05),

6. 9756728 - Component-mounted structure (2017-09-05),

7. 9609760 - Electronic component mounting method (2017-03-28),

8. 9516749 - Electronic component-mounted structure, IC card and COF package (2016-12-06),

9. 9015932 - Connecting method of electronic component (2015-04-28),

10. 8960526 - Flux for soldering and soldering process (2015-02-24),

11. 8851138 - Substrate backing device and substrate thermocompression-bonding device (2014-10-07),

12. 8817487 - Electronic component mounting system and electronic component mounting method (2014-08-26),

13. 8759688 - Electronic component mounting structure (2014-06-24),

14. 8686299 - Electronic element unit and reinforcing adhesive agent (2014-04-01),

15. 8499998 - Component built-in circuit substrate and method of producing the same (2013-08-06),

Title: Tadahiko Sakai - Innovative Inventor from Fukuoka, JP

Introduction: Tadahiko Sakai is a renowned inventor hailing from Fukuoka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tadahiko Sakai holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Sakai has worked with leading research institutions and technology companies, consistently pushing the boundaries of what is possible in the world of invention.

Collaborations: Throughout his career, Tadahiko Sakai has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and creativity that has led to numerous successful projects and inventions.

Conclusion: Tadahiko Sakai's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to dream big and think outside the box.

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