The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Feb. 21, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yoshiyuki Wada, Osaka, JP;

Tadahiko Sakai, Osaka, JP;

Koji Motomura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/09 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); G06K 19/077 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); G06K 19/07718 (2013.01); G06K 19/07745 (2013.01); H01L 21/4853 (2013.01); H01L 23/145 (2013.01); H01L 23/4985 (2013.01); H01L 23/49855 (2013.01); H01L 23/49866 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H05K 1/0274 (2013.01); H05K 1/0313 (2013.01); H05K 1/181 (2013.01); H05K 3/321 (2013.01); G02F 1/1303 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/13008 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/1336 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/1349 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13301 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13318 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13357 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/13369 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7526 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75262 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/8159 (2013.01); H01L 2224/8166 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81127 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81601 (2013.01); H01L 2224/81611 (2013.01); H01L 2224/81618 (2013.01); H01L 2224/81624 (2013.01); H01L 2224/81639 (2013.01); H01L 2224/81644 (2013.01); H01L 2224/81647 (2013.01); H01L 2224/81655 (2013.01); H01L 2224/81657 (2013.01); H01L 2224/81664 (2013.01); H01L 2224/81669 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81871 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/19105 (2013.01); H05K 3/12 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10674 (2013.01);
Abstract

Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.


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