The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jul. 05, 2021
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Masayuki Mantani, Saga, JP;
Tadahiko Sakai, Fukuoka, JP;
Tadashi Maeda, Fukuoka, JP;
Yuki Yoshioka, Fukuoka, JP;
Abstract
A mounting substrate manufacturing method for soldering a terminal of an electronic component to a landof a substrateincludes: a paste disposing step of disposing a solder paste on the land; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated areacoated with solder, on the land; a breaking step of breaking a residue covering a surface of the precoated areaby pressing a toolagainst the precoated area; a flux disposing step of disposing a flux F on the precoated area; a component placement step of placing an electronic component on the substrate, with the terminal of the electronic component aligned with the precoated area; and a reflow step of heating the substrateto melt the precoated area, to solder the terminal to the land. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.