The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
May. 26, 2010
Koji Motomura, Osaka, JP;
Seiichi Yoshinaga, Yamanashi, JP;
Tadahiko Sakai, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An electronic element unit () includes an electronic element () having a plurality of connecting terminals () on a lower surface thereof, a circuit board () having a plurality of electrodes () corresponding to the connecting terminals () on an upper surface thereof. The connecting terminals () and the electrodes () are connected by solder bumps (), and the electronic element () and the circuit board () are partly bond by a resin bond part () made of a thermosetting material of a thermosetting resin, and a metal powder () is included in the resin bond parts () in a dispersed state. The metal powder () has a melting point lower than a temperature at which the resin bond parts () are heated when a work (a repairing work) is carried out for removing the electronic element () from the circuit board ().