The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Dec. 26, 2007
Tadahiko Sakai, Fukuoka, JP;
Hideki Eifuku, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Hideki Eifuku, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. When a first connection terminal groupformed on a connection areaof a rigid boardis connected to a flexible boardwhere a second connection terminal grouphas been formed by employing a thermosetting resin in an electrically conductive manner, since a connection areawhich is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection areaamong such moisture, and oils and fats, which have been absorbed in the rigid boardare dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal groupand the second connection terminal groupis thermally hardened. Since the connection areais locally preheated, the dehumidification can be carried out within a short time without giving a thermal influence to an electronic componentwhich has already been mounted on the rigid board