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For the Inventor, By the Inventor

Fukuoka, Japan

Hideki Eifuku

This inventor holds 24 USPTO granted patents and 1 published patent application, primarily in Electronic Component Manufacturing. Top assignees: Panasonic Corporation, Matsushita Electric Industrial Co., Ltd., Panasonic Intellectual Property Management Co., Ltd.. Active years: 1998-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Eifuku. Retrieved from https://idiyas.com/inventor/hideki-eifuku

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 87.5

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 112(Granted Patents)


Location History:

  • Oomuta, JP (1998)
  • Omuta, JP (1999 - 2001)
  • Fukuoka, JP (2010 - 2015)
  • Osaka, JP (2013 - 2018)

Company Filing History:

goldMedal15 out of 16,454 
 
Panasonic Corporation
 patents
silverMedal5 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
bronzeMedal4 out of 13,338 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents
4. 1 out of 89 
 
Namics Corporation
 patents
where one patent can have more than one assignee

Years Active: 1998-2018

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Areas of Expertise:
Circuit Board Interconnection
Electronic Component Mounting
Soldering Method
Joining Structure
Thermocompression Bonding
Component-Mounted Structure
Substrate Backing Device
Manufacturing Method
Electrode Joining
Bumped Electronic Components
Semiconductor Chip Bonding
Mounting Adhesive
24 patents (USPTO):Explore Patents
1. 10080298 - Circuit board interconnection structure and circuit board interconnection method (2018-09-18),
2. 10034389 - Electric component mounting method (2018-07-24),
3. 9949380 - Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component (2018-04-17),
4. 9839143 - Electrode joining method, production method of electrode joined structure (2017-12-05),
5. 9756728 - Component-mounted structure (2017-09-05),
6. 9015932 - Connecting method of electronic component (2015-04-28),
7. 8851138 - Substrate backing device and substrate thermocompression-bonding device (2014-10-07),
8. 8817487 - Electronic component mounting system and electronic component mounting method (2014-08-26),
9. 8434665 - Electronic component mounting system and electronic component mounting method (2013-05-07),
10. 8188605 - Components joining method and components joining structure (2012-05-29),
11. 8148253 - Electronic component soldering structure and electronic component soldering method (2012-04-03),
12. 8034447 - Electronic components mounting adhesive and electronic components mounting structure (2011-10-11),
13. 8025205 - Electronic component mounting method (2011-09-27),
14. 8018074 - Components joining method and components joining structure (2011-09-13),
15. 7886432 - Electric components connecting method (2011-02-15),

Title: The Innovative Journey of Hideki Eifuku

Introduction: Hideki Eifuku, a talented inventor hailing from Fukuoka, Japan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Hideki Eifuku holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his diverse range of expertise and creativity.

Career Highlights: Throughout his illustrious career, Hideki Eifuku has worked with leading tech companies to develop cutting-edge solutions that have revolutionized various industries. His passion for innovation and problem-solving has led to the creation of products that have improved the lives of many.

Collaborations: Hideki Eifuku has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the development of groundbreaking technologies that have set new industry standards.

Conclusion: Hideki Eifuku's relentless pursuit of innovation and his dedication to pushing the boundaries of technology make him a true visionary in the world of inventions. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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