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Namics Corporation

USPTO Granted Patents = 84

EPO Patents = 33

Trademarks = 17

Forward Citations = 110

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110 inventors (with patents filed for the assignee):

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toyokazu Hotchi (6 out of 6 patents)

6. Masaaki Hoshiyama (6 out of 6 patents)

7. Kazuki Iwaya (6 out of 6 patents)

8. Toshiyuki Sato (6 out of 6 patents)

9. Hiroshi Sato (6 out of 6 patents)

10. Osamu Suzuki (6 out of 7 patents)

11. Tomoyuki Takahashi (5 out of 5 patents)

12. Pawel Czubarow (5 out of 17 patents)

13. Hitoshi Masumura (5 out of 6 patents)

14. Shoichi Iwaya (5 out of 5 patents)

15. Hiroshi Sasagawa (5 out of 5 patents)

Core Competencies:

Liquid Resin Composition

Curing Catalyst

Conductive Paste

Composite Copper Components

Thermally Conductive Adhesives

Electro-Conductive Paste

Semiconductor Device

Solar Cell Module

Resin Composition

Varistor Forming Paste

Stretchable Conductive Film

Heat Conductive Paste

84 patents: Sort by Forward Citations

1. 12454612 - Liquid resin composition for compression molding and electronic component apparatus (2025-10-28),

2. 12384874 - Curing catalyst, resin composition, sealing material, adhesive and cured product (2025-08-12),

3. 12336116 - Composite copper components (2025-06-17),

4. 12304818 - Porous carbon and resin composition (2025-05-20),

5. 12146014 - Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound (2024-11-19),

6. 12131970 - Liquid resin composition for sealing and electronic component apparatus (2024-10-29),

7. 11935673 - Varistor forming paste, cured product thereof, and varistor (2024-03-19),

8. 11932771 - Stretchable conductive paste and film (2024-03-19),

9. 11850625 - Syringe filled with resin composition and storage method therefor (2023-12-26),

10. 11817398 - Conductive paste (2023-11-14),

11. 11781236 - Composite copper foil (2023-10-10),

12. 11773301 - Resin composition (2023-10-03),

13. 11674793 - Residual thermal strain measurement method, residual thermal strain measurement device, and program therefor (2023-06-13),

14. 11634615 - Resin composition (2023-04-25),

15. 11623813 - Resin composition-filled syringe, and production method and preservation method for same (2023-04-11),

NAMICS CORPORATION is a global leader in advanced materials and manufacturing technologies. With a focus on innovation and quality, NAMICS provides solutions for a wide range of industries, including electronics, automotive, medical, and telecommunications. Their products range from adhesive materials and conductive pastes to thermal interface materials and precision parts. With a commitment to sustainability and customer satisfaction, NAMICS strives to exceed expectations and drive technological advancements in various fields.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

84 Patents

#2 in Niigata

#1,231 in Japan

#8,762 in the World

Namics Corporation

Forward Citations = 110

110 inventors:

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toyokazu Hotchi (6 out of 6 patents)

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