For the Inventor, By the Inventor

Enter assignee name

Namics Corporation

USPTO Granted Patents = 89

% Expired Patents = 1.1

EPO Patents = 35

Trademarks = 9

Forward Citations = 122

Loading Chart...

Loading Chart...

114 inventors (with patents filed for the assignee):

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toshiyuki Sato (7 out of 7 patents)

6. Toyokazu Hotchi (6 out of 6 patents)

7. Masaaki Hoshiyama (6 out of 6 patents)

8. Kazuki Iwaya (6 out of 6 patents)

9. Hiroshi Sato (6 out of 6 patents)

10. Osamu Suzuki (6 out of 7 patents)

11. Yoshitaka Kamata (5 out of 5 patents)

12. Tomoyuki Takahashi (5 out of 5 patents)

13. Pawel Czubarow (5 out of 17 patents)

14. Hitoshi Masumura (5 out of 6 patents)

15. Shoichi Iwaya (5 out of 5 patents)

Core Competencies:

Resin Composition

Conductive Paste

Semiconductor Device

Thermosetting Resin

Liquid Sealing Material

Solar Cell

Varistor

Copper Paste

Electro-Conductive Paste

Curing Agent

Lithium Ion Battery

Conductive Adhesive

89 patents: Sort by Forward Citations

1. 12630668 - Liquid compression molding material (2026-05-19),

2. 12604416 - Laminate for wiring board (2026-04-14),

3. 12577331 - Resin composition (2026-03-17),

4. 12534591 - Low-voltage varistor, circuit board, semiconductor component package, and interposer (2026-01-27),

5. 12518889 - Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body (2026-01-06),

6. 12454612 - Liquid resin composition for compression molding and electronic component apparatus (2025-10-28),

7. 12384874 - Curing catalyst, resin composition, sealing material, adhesive and cured product (2025-08-12),

8. 12336116 - Composite copper components (2025-06-17),

9. 12304818 - Porous carbon and resin composition (2025-05-20),

10. 12146014 - Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound (2024-11-19),

11. 12131970 - Liquid resin composition for sealing and electronic component apparatus (2024-10-29),

12. 11935673 - Varistor forming paste, cured product thereof, and varistor (2024-03-19),

13. 11932771 - Stretchable conductive paste and film (2024-03-19),

14. 11850625 - Syringe filled with resin composition and storage method therefor (2023-12-26),

15. 11817398 - Conductive paste (2023-11-14),

Namics Corporation, headquartered in Niigata, Japan, specializes in the development and manufacturing of advanced resin compositions. The company focuses on a range of core technology areas, including conductive pastes, thermosetting resins, and liquid sealing materials. Namics plays a significant role in the semiconductor device and solar cell industries, providing innovative solutions that enhance performance and reliability. Their expertise extends to varistors and copper pastes, positioning them as a key player in the materials science sector.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

Namics Corporation

89 Patents

#2 in Niigata

#1,209 in Japan

#8,600 in the World

Namics Corporation

Forward Citations = 122

114 inventors:

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toshiyuki Sato (7 out of 7 patents)

Please report any incorrect information to [email protected]

Loading…