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Namics Corporation

USPTO Granted Patents = 89

% Expired Patents = 1.1

EPO Patents = 35

Trademarks = 9

Forward Citations = 122

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114 inventors (with patents filed for the assignee):

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toshiyuki Sato (7 out of 7 patents)

6. Toyokazu Hotchi (6 out of 6 patents)

7. Masaaki Hoshiyama (6 out of 6 patents)

8. Kazuki Iwaya (6 out of 6 patents)

9. Hiroshi Sato (6 out of 6 patents)

10. Osamu Suzuki (6 out of 7 patents)

11. Yoshitaka Kamata (5 out of 5 patents)

12. Tomoyuki Takahashi (5 out of 5 patents)

13. Pawel Czubarow (5 out of 17 patents)

14. Hitoshi Masumura (5 out of 6 patents)

15. Shoichi Iwaya (5 out of 5 patents)

Core Competencies:

Resin Composition

Conductive Paste

Semiconductor Device

Thermosetting Resin

Liquid Sealing Material

Solar Cell

Varistor

Copper Paste

Electro-Conductive Paste

Curing Agent

Lithium Ion Battery

Conductive Adhesive

89 patents: Sort by Forward Citations

1. 12630668 - Liquid compression molding material (2026-05-19),

2. 12604416 - Laminate for wiring board (2026-04-14),

3. 12577331 - Resin composition (2026-03-17),

4. 12534591 - Low-voltage varistor, circuit board, semiconductor component package, and interposer (2026-01-27),

5. 12518889 - Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body (2026-01-06),

6. 12454612 - Liquid resin composition for compression molding and electronic component apparatus (2025-10-28),

7. 12384874 - Curing catalyst, resin composition, sealing material, adhesive and cured product (2025-08-12),

8. 12336116 - Composite copper components (2025-06-17),

9. 12304818 - Porous carbon and resin composition (2025-05-20),

10. 12146014 - Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound (2024-11-19),

11. 12131970 - Liquid resin composition for sealing and electronic component apparatus (2024-10-29),

12. 11935673 - Varistor forming paste, cured product thereof, and varistor (2024-03-19),

13. 11932771 - Stretchable conductive paste and film (2024-03-19),

14. 11850625 - Syringe filled with resin composition and storage method therefor (2023-12-26),

15. 11817398 - Conductive paste (2023-11-14),

NAMICS CORPORATION is a global leader in advanced materials and manufacturing technologies. With a focus on innovation and quality, NAMICS provides solutions for a wide range of industries, including electronics, automotive, medical, and telecommunications. Their products range from adhesive materials and conductive pastes to thermal interface materials and precision parts. With a commitment to sustainability and customer satisfaction, NAMICS strives to exceed expectations and drive technological advancements in various fields.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

Namics Corporation

89 Patents

#2 in Niigata

#1,209 in Japan

#8,585 in the World

Namics Corporation

Forward Citations = 122

114 inventors:

Noriyuki Sakai (10 out of 10 patents)

Takayuki Fujita (9 out of 9 patents)

Fuminori Arai (9 out of 9 patents)

4. Haruyuki Yoshii (8 out of 8 patents)

5. Toshiyuki Sato (7 out of 7 patents)

Please report any incorrect information to [email protected]

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