The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Oct. 22, 2020
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/385 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 3/389 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/0796 (2013.01); H05K 2203/124 (2013.01);
Abstract
The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.