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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12131970 B1

PDFFull Text
Date of Patent:
Oct. 29, 2024

Filed:

May. 31, 2018

Liquid resin composition for sealing and electronic component apparatus

Applicants:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Namics Corporation, Niigata, JP;

Inventors:

Hidetoshi Inoue, Tokyo, JP;

Takayuki Matsuzaki, Tokyo, JP;

Hisato Takahashi, Tokyo, JP;

Tsuyoshi Kamimura, Niigata, JP;

Haruyuki Yoshii, Niigata, JP;

Assignees:

Resonac Corporation, Tokoyo, JP;

Namics Corporation, Niigata, JP;

Attorney:

Fitch, Even, Tabin & Flannery LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C08G 59/28 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/62 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C08L 63/00 (2006.01); C09K 3/10 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/5073 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); C09K 3/1025 (2013.01); C08G 2190/00 (2013.01); C09K 2200/0247 (2013.01); C09K 2200/0647 (2013.01);
Abstract

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Find Patent Forward Citations

Inoue, Hidetoshi. (2024). Liquid resin composition for sealing and electronic component apparatus (U.S. Patent No. 12131970). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12131970

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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