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Resonac Corporation

USPTO Granted Patents = 295

EPO Patents = 130

Trademarks = 34

Forward Citations = 23

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519 inventors (with patents filed for the assignee):

Yoshishige Okuno (12 out of 24 patents)

Tomohiko Kotake (11 out of 32 patents)

Daisuke Yagyu (11 out of 26 patents)

4. Kazuma Matsui (11 out of 16 patents)

5. Tsuyoshi Kato (11 out of 11 patents)

6. Yoshinori Ejiri (10 out of 27 patents)

7. Tomohiro Iwano (10 out of 42 patents)

8. Naoya Fukumoto (10 out of 28 patents)

9. Nobuyuki Takahashi (8 out of 107 patents)

10. Tomoyasu Hasegawa (8 out of 13 patents)

11. Natsumi Shibata (8 out of 8 patents)

12. Hiromasa Suo (8 out of 8 patents)

13. Takaaki Matsumoto (7 out of 12 patents)

14. Yoshitaka Takezawa (7 out of 46 patents)

15. Eriko Takeda (7 out of 19 patents)

Core Competencies:

Aqueous Coating Liquid

Thermally Conductive Resin

Hexagonal Boron Nitride

P-Type SiC Epitaxial Wafer

Lithium Ion Secondary Battery

Organic Electronic Material

Machine Learning Device

Polishing Solution

Electrode Binder

Copper-Clad Laminate

Photosensitive Resin Composition

Plant Activator

295 patents: Sort by Forward Citations

1. 12522930 - Metal removal method, dry etching method, and production method for semiconductor element (2026-01-13),

2. 12522748 - Slurry, polishing method, and method for producing semiconductor component (2026-01-13),

3. 12519108 - Negative electrode material for lithium ion secondary battery, negative electrode for lithium ion secondary battery, and lithium ion secondary battery (2026-01-06),

4. 12518787 - Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium (2026-01-06),

5. 12516444 - SiC single crystal substrate (2026-01-06),

6. 12510482 - Gas analyzing method (2025-12-30),

7. 12498636 - Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board (2025-12-16),

8. 12486423 - Composition for aqueous coating liquid (2025-12-02),

9. 12486357 - Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium (2025-12-02),

10. 12480031 - Thermally conductive resin composition, cured product, heat transfer member and electronic device (2025-11-25),

11. 12478001 - Plant activator containing amino acid or salt thereof, and oligosaccharide, and use thereof (2025-11-25),

12. 12473651 - Ornament and silver mirror film-forming liquid (2025-11-18),

13. 12473479 - Hexagonal boron nitride powder and method for producing the same, and composition and heat dissipation material using the same (2025-11-18),

14. 12469716 - Plasma etching method and method for manufacturing semiconductor element (2025-11-11),

15. 12467159 - P-type SiC epitaxial wafer and production method therefor (2025-11-11),

Resonac Corporation is a leading technology company specializing in acoustic solutions and audio processing. With a vast portfolio of high-quality speakers, audio accessories, and software, Resonac delivers immersive sound experiences to customers worldwide. Our innovative products are designed to enhance audio quality in various applications, including consumer electronics, automotive, home entertainment, and professional audio systems. Through continuous research and development, Resonac stays at the forefront of acoustic technologies, bringing breakthrough solutions that redefine audio experiences.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 13 2026

295 Patents

#250 in Tokyo

#532 in Japan

#2,941 in the World

Resonac Corporation

Forward Citations = 23

519 inventors:

Yoshishige Okuno (12 out of 24 patents)

Tomohiko Kotake (11 out of 32 patents)

Daisuke Yagyu (11 out of 26 patents)

4. Kazuma Matsui (11 out of 16 patents)

5. Tsuyoshi Kato (11 out of 11 patents)

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