The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Dec. 09, 2020
Applicant:
Namics Corporation, Niigata, JP;
Inventor:
Masayoshi Otomo, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 22/10 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C08F 22/1006 (2020.02); C08K 3/08 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/085 (2013.01);
Abstract
A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.