The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
May. 31, 2018
Applicants:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Namics Corporation, Niigata, JP;
Inventors:
Hidetoshi Inoue, Tokyo, JP;
Takayuki Matsuzaki, Tokyo, JP;
Hisato Takahashi, Tokyo, JP;
Tsuyoshi Kamimura, Niigata, JP;
Haruyuki Yoshii, Niigata, JP;
Assignees:
Resonac Corporation, Tokyo, JP;
NAMICS Corporation, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/28 (2006.01); C08G 59/32 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 5/3445 (2006.01); C08K 5/5419 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/28 (2013.01); C08G 59/3227 (2013.01); C08K 3/04 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/5419 (2013.01); H01L 23/295 (2013.01); H01L 23/3107 (2013.01); C08K 2201/003 (2013.01);
Abstract
A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).