The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Apr. 20, 2021
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/02 (2006.01); B29C 43/00 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); C08G 59/14 (2006.01); C08G 59/20 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08K 3/36 (2006.01); C08K 9/06 (2006.01); C08L 63/00 (2006.01); H10W 74/10 (2026.01); H10W 74/40 (2026.01);
U.S. Cl.
CPC ...
C08G 59/02 (2013.01); B29C 43/003 (2013.01); C08G 59/1444 (2013.01); C08K 3/36 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0094 (2013.01); C08K 2201/005 (2013.01);
Abstract
A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.