logo

For the Inventor, By the Inventor

Niigata, Japan

Toyokazu Hotchi

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Namics Corporation. Active years: 2016-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toyokazu Hotchi. Retrieved from https://idiyas.com/inventor/toyokazu-hotchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal6 out of 89 
 
Namics Corporation
 patents

Years Active: 2016-2022

Loading Chart...
6 patents (USPTO):Explore Patents
1. 11485848 - NCF for pressure mounting, cured product thereof, and semiconductor device including same (2022-11-01),
2. 11315846 - Semiconductor device (2022-04-26),
3. 10738187 - Resin composition and semiconductor device (2020-08-11),
4. 10388583 - Thermosetting resin composition and method of producing same (2019-08-20),
5. 10023775 - Film adhesive and semiconductor device including the same (2018-07-17),
6. 9417228 - Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method (2016-08-16),

Title: The Innovations of Toyokazu Hotchi

Introduction

Toyokazu Hotchi is a prominent inventor based in Niigata, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work focuses on developing advanced materials and devices that enhance the performance and reliability of semiconductor applications.

Latest Patents

Hotchi's latest patents include a non-conductive film (NCF) designed for pressure mounting in semiconductor devices. This innovative NCF comprises a solid epoxy resin, a liquid aromatic amine, a silica filler, and a polymer resin. The unique formulation allows for effective curing under pressure, making it suitable for various semiconductor applications. Additionally, he has developed a semiconductor device that minimizes peeling between the mold resin and the substrate, ensuring better adhesion and performance.

Career Highlights

Throughout his career, Hotchi has been recognized for his innovative approaches to semiconductor technology. His patents reflect a deep understanding of material science and engineering principles. His work has contributed to advancements in the efficiency and reliability of semiconductor devices, which are crucial in modern electronics.

Collaborations

Hotchi has collaborated with notable colleagues, including Masaaki Hoshiyama and Yoshihide Fukuhara. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise, leading to groundbreaking innovations in their field.

Conclusion

Toyokazu Hotchi's contributions to semiconductor technology exemplify the impact of innovative thinking in engineering. His patents and collaborative efforts continue to shape the future of electronics, demonstrating the importance of research and development in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…