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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388583 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Oct. 08, 2015

Thermosetting resin composition and method of producing same

Applicant:

Namics Corporation, Niigata, JP;

Inventors:

Masaaki Hoshiyama, Niigata, JP;

Toyokazu Hotchi, Niigata, JP;

Toshiaki Enomoto, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:

Westman, Champlin & Koehler, P.A.

Primary Examiner:

Brooke Kebede

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/29 (2006.01); C08F 2/44 (2006.01); C08K 5/3437 (2006.01); C09J 11/06 (2006.01); C08L 33/06 (2006.01); C08L 63/04 (2006.01); C08L 101/00 (2006.01); H01L 23/00 (2006.01); C08G 59/62 (2006.01); H01L 21/56 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); C08F 2/44 (2013.01); C08G 59/621 (2013.01); C08K 5/3437 (2013.01); C08L 33/06 (2013.01); C08L 63/04 (2013.01); C08L 101/00 (2013.01); C09J 11/06 (2013.01); H01L 23/293 (2013.01); H01L 24/83 (2013.01); C08F 2222/1013 (2013.01); H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/181 (2013.01);
Abstract

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

Find Patent Forward Citations

Hoshiyama, Masaaki. (2019). Thermosetting resin composition and method of producing same (U.S. Patent No. 10388583). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10388583

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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