The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Apr. 21, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hideki Eifuku, Osaka, JP;

Koji Motomura, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H05K 1/03 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 3/323 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10234 (2013.01);
Abstract

Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.


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