Electronic component mounting system and electronic component mounting method

Abstract

Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system () includes a solder printing device (M), a coating/inspection device (M), a component mounting device (M), a bonding material supply/substrate mounting device (M), and a reflow device (M). The electronic component mounting system () mounts an electronic component on a main substrate () and connects a module substrate () to the main substrate (). A cream solder is printed on the main substrate () to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (), and a second connection portion of the module substrate () is landed on the first connection portion through the bonding material. Thereafter, the main substrate () is carried in the reflow device (M) and heated in the same reflow step to solder-bond the electronic component onto the main substrate () and to bond the second connection portion of the module substrate () and the first connection portion of the main substrate () together by the bonding material.