The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Jul. 28, 2011
Tadahiko Sakai, Fukuoka, JP;
Hideki Eifuku, Fukuoka, JP;
Yoshiyuki Wada, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particlesin a thermosetting resin, a rigid substrateand a flexible substrateare bonded by the thermosetting resin, and a first terminaland a second terminalare electrically connected by the solder particles, a blending ratio of an activator of the thermosetting resinin the solder paste is properly set and oxide film removed portions, andare partially formed in oxide films, andof the first terminal, the second terminal, and the solder particles. Thereby, the first terminaland the second terminalare electrically conducted by solder bonding the solder particlesto both the first terminaland the second terminalvia the oxide film removed portionsand, and while fusion of the solder particleswith each other is prevented in the thermosetting resin, connection of components at a low electrical resistance is realized with high reliability.